Sunday, January 25, 2026

Beyond Silicon: Fudan University Unveils "Fiber Chips"—Thin as Hair, Powerful as a Computer

Beyond Silicon: Fudan University Unveils "Fiber Chips"—Thin as Hair, Powerful as a Computer
Beyond Silicon: Fudan University Unveils "Fiber Chips"—Thin as Hair, Powerful as a Computer

A team of scientists from Fudan University, China, has achieved a groundbreaking milestone in flexible electronics. Published in the prestigious journal Nature on January 22, 2026, their research introduces "Fiber Chips"—intelligent fibers thinner than a human hair that possess the processing power of a standard computer.

The "Sushi Roll" Breakthrough

Creating complex integrated circuits on soft, bendable materials has long been considered nearly impossible. Professor Peng Huisheng, the lead researcher, describes the challenge as "trying to build a skyscraper on a field of soft, uneven mud."

The team solved this using a revolutionary "Sushi Roll Technique":

  1. Flat Circuit Fabrication: High-precision circuits (transistors, resistors, capacitors) are first printed onto a nanometer-thin flexible elastomer.

  2. Protective Coating: A high-density layer is applied to shield the electronics from moisture and chemicals.

  3. The Roll: The film is then tightly wound around a polymer core, creating a multi-layered fiber structure that packs immense power into a microscopic diameter.

Small Size, Massive Specs

The performance of these fiber chips is staggering:

  • Density: A single centimeter of fiber can house 100,000 transistors.

  • Processing Power: A one-meter strand contains as many transistors as a standard PC CPU.

  • Extreme Durability: It can withstand over 10,000 cycles of bending and abrasion. Most impressively, the fiber continues to function even after being run over by a 15.6-ton truck

Three Industries Poised for Revolution

1. Brain-Computer Interface (BCI)

Traditional brain implants are rigid, often causing tissue inflammation. Fiber chips share the mechanical softness of human tissue, allowing for seamless integration into the brain to monitor neural signals and treat neurological disorders with unprecedented safety.

2. Interactive Smart Textiles

The era of "wearable computers" is evolving. Imagine sleeves that act as high-definition video displays or touch-sensitive control panels, allowing users to navigate maps or check health vitals directly through their clothing without a smartphone.

3. Immersive VR/AR Haptics

By weaving these chips into gloves or full-body suits, VR environments can achieve hyper-realistic haptic feedback. Processing occurs at every point of contact on the fabric, eliminating latency and enhancing the sense of touch in virtual worlds.

  • A not-so-discussed highlight is its "heat dissipation." Because the chip is made of long fibers, it has a very large surface area in contact with the air, resulting in superior heat dissipation compared to traditional rectangular chips, reducing overheating issues during heavy use.
  • The research team is developing a version using biodegradable polymers so that future smart clothes won't become environmentally damaging e-waste, but will be naturally biodegradable.
  • While China leads in "fibers," the US and Europe are accelerating the development of "liquid metal circuits." This competition will transform the fashion tech industry into a high-tech industry in the coming years.
  • The sushi-style rolling technique is designed to be compatible with current industrial spinning mills, meaning we may see mass production of "computer fabric" faster than expected. 

 

Samsung has launched a new generation of NAND memory using FeFET technology, capable of writing 5 bits of data per cell and consuming 96% less power than before.

 

Source: Xinhua 

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