MediaTek Adopts Both TSMC CoWoS and Intel EMIB to Bypass AI Chip Bottlenecks.
MediaTek Validates Dual-Source Advanced Packaging, Supporting Both TSMC CoWoS and Intel EMIB for Custom AI Silicon In a strategic move to diversify its manufacturing ecosystem, MediaTek has officially announced full architectural support for next-generation advanced packaging technologies from both TSMC and Intel . This positioning establishes MediaTek as one of the elite few fabless chip designers capable of deploying dual-platform architectures specifically leveraging TSMC’s CoWoS and Intel’s EMIB platforms customized entirely to sovereign client infrastructure demands. Deconstructing the Interconnect Technologies: CoWoS vs. EMIB Advanced packaging has become the primary bottleneck and performance multiplier in high-performance computing (HPC) and artificial intelligence: TSMC CoWoS (Chip-on-Wafer-on-Substrate): TSMC’s signature 2.5D packaging standard. CoWoS integrates multiple silicon dies onto a single passive silicon interposer, serving as the foundational architectural back...